MAX8834Y/MAX8834Z
Adaptive Step-Up Converters
with 1.5A Flash Driver
Table 18. CHIP_ID2
This register contains the die type dash number (0 = plain) and mask revision level.
REGISTER NAME
Address
Reset Value
Type
Special Features
CHIP_ID2
0x1B
N/A
Read
BIT
NAME
DESCRIPTION
DEFAULT VALUE
B7 (MSB)
B6
B5
DASH
BCD Character representing dash number
B4
B3
B2
B1
MASK_REV
BCD Character representing die revision
B0 (LSB)
Note: This register value is fixed in metal.
Applications Information
Inductor Selection
See Table 19 for a list of recommended inductors. To
prevent core saturation, ensure that the inductor satura-
tion current rating exceeds the peak inductor current
for the application. Calculate the worst-case peak
inductor current as follows:
most situations, but a 4.7μF ceramic capacitor is
acceptable for lower load currents.
Compensation Network Selection
The step-up converter is compensated for stability
through an external compensation network from COMP
to AGND. See Table 20 for recommended compensa-
tion networks.
I PEAK =
V OUT × I OUT (MAX )
0 . 9 × V IN ( MIN )
+
V IN ( MIN )
2 × f SW × L
PCB Layout
Due to fast-switching waveforms and high-current
paths, careful PCB layout is required. Connect AGND,
FGND, and PGND directly to the ground plane. The IN
where f SW is the switching frequency.
Capacitor Selection
Bypass IN to AGND and PGND with a ceramic capaci-
tor. Ceramic capacitors with X5R and X7R dielectrics are
recommended for their low ESR and tighter tolerances
over wide temperature ranges. Place the capacitor as
close as possible to the IC. The recommended minimum
value for the input capacitor is 10μF; however, larger
value capacitors can be used to reduce input ripple at
the expense of size and higher cost.
The output capacitance required depends on the out-
put current. A 10μF ceramic capacitor works well in
Maxim Integrated
bypass capacitor should be placed as close as possi-
ble to the IC. R COMP and C COMP should be connected
between COMP and AGND as close as possible to the
IC. Minimize trace lengths between the IC and the
inductor, the input capacitor, and the output capacitor;
keep these traces short, direct, and wide. The ground
connections of C IN and C OUT should be as close
together as possible and connected to PGND. The
traces from the input to the inductor and from the out-
put capacitor to the LEDs may be longer. Figure 21
illustrates an example PCB layout and routing scheme.
Refer to the MAX8834Y/MAX8834Z Evaluation Kit for a
PCB layout example.
39
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MAX8836ZEWEEE+ 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
MAX8836ZEWEEE+T 制造商:Maxim Integrated Products 功能描述:
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MAX883C/D DIE 制造商:Maxim Integrated Products 功能描述:
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